Advanced Packaging

Advanced packaging solutions of photonics components on different platforms is needed to ensure reliable device operation with optimal optical and electrical interfacing. Our state-of-art knowhow and infrastructure provide a versatile capability to cover development chain from prototyping and industrial scale fabrication including design, design review and design for manufacture capabilities. Fast development cycles allows rapid evaluation of the feasibility of packaging concepts. MedPhab advanced packaging related offering covers packaging at wafer, chip, and module level on rigid and flexible carriers. High-precision photonics assembly can be made using, flip-chip, die attach, soldering and adhesive bonding. As post-processing for enhanced reliability the assemblies can be encapsulated including hermetic sealing.